¤ý Integrated measurement of optical, electrical and thermal dependency required in wafer level.
¤ý Automation of measurement and convenient user environment.
¤ý Observation of Chip Current spreading and degradation using high resolution microscope and camera.
¤ý Function integration and verification by a number of reseachers.
¤ý Provide CIE measurement mode andKRISS standard value.
¤ý High precision measurement using Keithley 2612
¤ý Low noise and high precision / reproduction using TE Cooled 2048 pixel CCD sensor.
¤ý Display light distribution characteristics in 2D/3D graphs and data list by analyzing, summarizing and duplicating measured data.