¤ýMeasurement of temperature and thermal resistance of PN connection part by analyzing physical property of high power LED.
¤ýMeasure thermal property of LED (Temperature and thermal resistance of connection part) in normal and excessive status.
¤ýObtain beneficial information for package design by analyzing functional process of high power LED and figuring out thermal flow.
¤ýSimultaneous measurement of optical properties and electrical property of LED to ambient temperature.
¤ýApplied to securing LED efficacy and stable temperature persistency in accordance with change of temperature in connection part.
¤ýSuitable for related R&D and QRA.