ㆍMeasure temperature in PN connection part and thermal resistance by analyzing physical property of high power LED.
ㆍMeasure thermal property of LED (Optical and thermal property) according to change of temperature in normal or excessive conditions.
ㆍObtain beneficial information for package design by analyzing functional output of high power LED and figuring out thermal flow.
ㆍSimultaneous measurement of optical and electrical property of LED in accordance with change of ambient temperature.
ㆍApplied for obtaining LED efficiency and temperature control in accordance with change of temperature in connection part.
ㆍSuitable for related R&D and QRA.
ㆍThermal property: K-factor at 1mA or 10mA of thermal resistance, temperature in P-N connection part, and functional output.
ㆍoptical properties: Max wavelength, dominant wavelength(λp, λd), luminous intensity, intensity radiation (Iv,Ie) CIE color coordinate(Cx, Cy), FWHM, Correlated color temperature(CCT), Color rendering index(CRI) , Optical efficiency(K), and Total Luminous flux(Φv,Φe)
ㆍElectrical property : Forward voltage, reverse voltage(Vf, Vr), Forward current, reverse current(If, Ir ) optical-current-voltage Sweep( L I V Sweep Curve)
|MEASUREMENT ITEMS||JUNTION TEMPERATURE||THERMAl RESISTANCE|
|Range||0℃ ~250℃||0℃/W ~999.9℃/W|
|Sampling rate||Max. 1 MHz|
|Channel||Input 2 ch|
|Frequency||200 KHz 이하|
|Pulse Width||1μ sec 이상|
|GUI & Hardware interface program|