ㆍMeasurement of temperature and thermal resistance of PN connection part by analyzing physical property of high power LED.
ㆍMeasure thermal property of LED (Temperature and thermal resistance of connection part) in normal and excessive status.
ㆍObtain beneficial information for package design by analyzing functional process of high power LED and figuring out thermal flow.
ㆍSimultaneous measurement of optical properties and electrical property of LED to ambient temperature.
ㆍApplied to securing LED efficacy and stable temperature persistency in accordance with change of temperature in connection part.
ㆍSuitable for related R&D and QRA.